Internet of Things Congress

At the congress “Internet of Things – From Sensor to Cloud” taking place in Munich October 25th, Jeannine Budelmann will discuss “Augmented reality glasses connected to ERP systems to optimize manual mounting of circuit boards”. As the managing director of Budelmann Elektronik (specialized in customized hard and software solutions), she is aware of difficulties during manual assembly. “Manual assembly of circuit boards is prone to mistakes on several levels. Sometimes it can be difficult to place the last component between two already mounted ones. Following a determined order can save both time and nerves.” explains Ms. Budelmann. Using data glasses connected to the ERP system does not only allow the user to receive relevant information during the assembly process but simultaneously monitors assembly quality.

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